"Requested_prod_id","Requested_GTIN(EAN/UPC)","Requested_Icecat_id","ErrorMessage","Supplier","Prod_id","Icecat_id","GTIN(EAN/UPC)","Category","CatId","ProductFamily","ProductSeries","Model","Updated","Quality","On_Market","Product_Views","HighPic","HighPic Resolution","LowPic","Pic500x500","ThumbPic","Folder_PDF","Folder_Manual_PDF","ProductTitle","ShortDesc","ShortSummaryDescription","LongSummaryDescription","LongDesc","ProductGallery","ProductGallery Resolution","ProductGallery ExpirationDate","360","EU Energy Label","EU Product Fiche","PDF","Video/mp4","Other Multimedia","ProductMultimediaObject ExpirationDate","ReasonsToBuy","Spec 1","Spec 2","Spec 3","Spec 4","Spec 5","Spec 6","Spec 7","Spec 8","Spec 9","Spec 10","Spec 11","Spec 12","Spec 13","Spec 14","Spec 15","Spec 16","Spec 17","Spec 18","Spec 19","Spec 20","Spec 21","Spec 22","Spec 23","Spec 24","Spec 25","Spec 26" "","","74060","","HP","354606-B21","74060","","處理器","989","","","Intel Xeon 3.06 GHz","20240307153452","ICECAT","1","76264","https://images.icecat.biz/img/gallery/18145629_9932.jpg","450x400","https://images.icecat.biz/img/gallery_lows/18145629_9932.jpg","https://images.icecat.biz/img/gallery_mediums/img_18145629_medium_1479821537_297_3554.jpg","https://images.icecat.biz/img/gallery_thumbs/18145629_9932.jpg","","","HP Intel Xeon 3.06 GHz 處理器 0.512 MB L2","","HP Intel Xeon 3.06 GHz, Intel® Xeon®, Socket 604 (mPGA604), 130 nm, 3.06 GHz, 32位元, 伺服器/工作站","HP Intel Xeon 3.06 GHz. 處理器系列: Intel® Xeon®, 處理器插座: Socket 604 (mPGA604), 處理器光刻: 130 nm. 市場區隔: 伺服器, 處理器尺寸電晶體數量: 55 M, 處理器晶圓尺寸: 131 mm². 處理器封裝大小: 42.5 mm","","https://images.icecat.biz/img/gallery/18145629_9932.jpg","450x400","","","","","","","","","","處理器","處理器系列: Intel® Xeon®","處理器核心數量: 1","處理器插座: Socket 604 (mPGA604)","處理器光刻: 130 nm","處理器基本頻率: 3.06 GHz","處理器操作模式: 32位元","零組件應用範圍: 伺服器/工作站","處理器高速緩存: 0.512 MB","處理器高速緩存類型: L2","處理器系統匯流排: 533 MHz","散熱設計功率(TDP): 85 W","VID電壓範圍: 1.352 - 1.467 V","FSB同位: 是","圖像","內建顯示卡: 不","產品特點","市場區隔: 伺服器","處理器尺寸電晶體數量: 55 M","處理器晶圓尺寸: 131 mm²","處理器的特殊功能","Intel®超執行緒技術: 是","操作條件","處理器容忍最高溫度: 73 °C","重量及尺寸","處理器封裝大小: 42.5 mm"